Industry News

Celera Motion, a specialist in precision motion component and sub-system solutions and a business unit of Novanta Corporation added Aura Absolute Chip Encoder Series to its line of precision rotary and linear optical encoders with MicroE technology.

Plus signed a strategic customer agreement with Ouster which will provide its digital LiDAR sensors to outfit key elements of Plus’s automated truck system.

HARDSIL® immunizes semiconductor devices against high temperature or radiation induced stresses without the need for special design techniques (RHBD) or expensive specialized semiconductor processes (RHBP).

II‐VI announced its double-junction vertical cavity surface-emitting laser (VCSEL) arrays, the first of its multi-junction VCSEL array platforms for next-generation world-facing 3D sensing applications.

Nexa3D announced it has expanded its partnership with Henkel to immediately deliver three new performance photopolymer materials through its expanding Nexa3D channels globally

Petasense, a specialist in IIoT sensors and asset reliability and optimization, launched the first industrial wired sensor that combines vibration, temperature and speed detection into a single sensor.

IOhub is the ICS data management solution that will completely revolutionize the way companies manage and handle data coming from industrial machines. EZ VPN created a flexible and simple solution to manage machine data that can be implemented without any specific IT knowledge by adding application as you would do with your cellphone.

VIAVI's patented optical filters achieve superior optical performance, a desired reduction in filter thickness, and a reduced center wavelength shift with a change in incidence angle of the reflected light.

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, introduced the EVG®320 D2W die preparation and activation system—the industry's first commercially available hybrid bond activation and cleaning system for die-to-wafer (D2W) bonding.

A technology partnership between an automotive LiDAR specialist Ibeo Automotive Systems and SICK has resulted in a 3D solid-state LiDAR sensor for industrial applications.